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  800M-1.4G IP Links 2W/5W-SDL530
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  800M-1.4G IP Links 10W
  600M-1.4G IP Links 300mW*2
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800M-1.4G-2.4G H265 Tx 300mW
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HDMI/AV Tx Module
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Relay Module
1W Power Amplifier

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DLB Transceiver Module
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2W Power Amplifier(800M/1.4G)
2W Power Amplifier(566~678M)
5W Power Amplifier(800M/1.4G)
5W Power Amplifier(566~678M)
10W Power Amplifier(800M/1.4G)
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5W PA for DLC Module

This PA-T605 power amplifier(PA) is a 5W linear power amplifier, designed for using with Sihid DLC module.

Features:

  • Frequency band: 566~678MHz
  • RF in: DLC module RF out(23±2dBm)
  • RF out power: 5W(37~39dBm)
  • PA-T605 Tx gain: 17dB±1.5, when used with DLC Module, set up the maximum RF power of DLC as 23~25 dBm, then the RF out power will be 37~39dbm. In the whole band of 566-678MHz, there are slight differences in gain at different center frequency, and the DLC module itself also has slight differences in RF output power at different center frequency. It is recommended to set the maximum output RF power of the DLC module to "23" when adding PA-T605 to work with DLC module.
  • LNA gain of the receiving channel: 20dB±1
  • Power in: DC24V~30V, minimum 1.5A@24V power current rating.
  • Power consumption: 24V power supply, set the RF power of the DLC module to "23" and works as 1D4U mode and transmitting data at full load, the average operating power consumption of PA-T605 module itself at access node is 13-18W.
  • Static current (without RF signal input): about 0.09A (24.2V input)
  • Dimensions: 52.9*40.5*13mm(not including the connector outside of the case)
  • Weight: 42g
  • Impedance: 50ohm

Working together with DLC Module:

I/O

Power in VDD: red color cable, GND: black color cable.
Control Two cables, should be connected to DLC Switch signal(SCL and GND). The input high(1.8V to 3.3V) will drive the amplifier and work in Tx mode. The input low will enable the PA module to work in Rx mode.
RF in SMA female connector for connection with antenna of DLC module.
RF out SMA female connector for connection with antenna.

Heat dissipation

The back side of the PA module should be assembled to metal directlyand tightly to help heat dissipation. For optimal performance it isimportant to include adequate heat dissipation strategies thatincorporate a heat sink or fan into any designs that integrate thePA module.

 

PA-T605 overview.pdf



Room 608, Dongbian Commerce Building, #222 Minzhi Road, Longhua District, Shenzhen, China 518131
Email: sale@sihid.com or zgrui123@hotmail.com, Phone:+86-755-23765232, Skype ID:embestzgr
Copyright©Sihid Technology Limited 2015-2024 all rights reserved.

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