PA1405/PA805 for DLM/DLB Module
This PA1405(or PA805) amplifier is a 5W linear power amplifier, designed for
using with Sihid DLM/DLB module.
Features:
- Frequency band: 1425MHz-1455MHz(PA1405), 800MHz-830MHz(PA805)
- RF in: DLM(or DLB) module RF out(25±2dBm)
- RF out power: 5W(37dBm)
- PA1405 Tx gain: 15dB, when used with DLB/DLM Module, set up
the maximum RF power of DLB/DLM as 22~25 dBm, then the RF out
power will be 37~39dbm.
- PA805 Tx gain: 17dB, when used with DLB/DLM Module, set up
the maximum RF power of DLB/DLM as 20~23 dBm, then the RF out
power will be 37~39dbm.
- Power in: DC24V~25V, minimum 1.8A@24V power current rating
- Power consumption: <14W average
- PCBA size: 46.5*31mm, thickness of PCB: 1.2mm
- Impedance: 50 ohm
Working together with
DLM(or DLB) Module:
I/O
Power in |
Two bonding pads, should be soldered to
connect with power VDD and GND. |
Control |
Two bonding pads, should be soldered to
connect with DLM(or DLB) Switch signal pad(SCL and GND). The
input high(1.8V to 3.3V) will drive the amplifier and work
in Tx mode. The input low will enable the PA module to work
in Rx mode. |
RF in |
IPEX connector for connection with main
antenna of DLM(or DLB) module. |
RF out |
Bonding pad, should be soldered to an antenna
connector. |
Housing case and assemble
Sihid PA1405/PA805 is just an OEM PCBA module. When you use this PA
to work with DLM(or DLB) module, you should make metal housing case
for your device, and a separated chamber must be designed for PA
board. And also, it should keep at least 6mm space between the PA
board and the upper cover. The back side of the PA board should be
assembled to the metal directly and tightly to help heat dissipation
and enable electrical grounding connection. For optimal performance
it is important to include adequate heat dissipation strategies that
incorporate a heat sink or fan into any designs that integrate the
PA OEM module.
Sihid can also make a metal chamber for this PA module according to
cutomer's requirement.
PA1405/PA805 overview.pdf
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